Supply and Demand Matching Conference for AI-Driven Advanced Packaging and Testing Development in the Greater Bay Area

On August 19, 2025, Shenzhen Zhengyan Microelectronics Co., Ltd. was invited to attend the "AI-Driven Advanced Packaging and Testing Development Supply and Demand Matching Conference" guided by the Shenzhen Development and Reform Commission and hosted by Shenzhen Chip Alliance and other organizations. The conference focused on the integration of AI computing chips with advanced packaging technologies. Company representatives engaged in in-depth discussions with enterprises such as Zhongke Feice and Jinyu Semiconductor, reaching multiple cooperation intents on technological upgrades and production capacity collaboration, and participated in discussions on collaborative innovation pathways involving government, industry, academia, and research. This participation provided an important opportunity for the company to expand technical cooperation and integrate into the regional industrial ecosystem.